Dynamic modeling of cutting force and surface generation in ultra-precision diamond cutting with microwavy profile effect

The ultra-precision diamond cutting (UPDC) employs larger cutting parameters in half-finishing process to improve machining efficiency, which introduces microwavy profile to the unmachined surface of finishing process with microscale cutting parameters. The paper makes theoretical and experimental investigations on the microwavy profile effect on cutting process and surface generation in UPDC. The influence of microwavy profile on the surface being machined is considered in diamond cutting process by studying its effect on the instantaneous cutting depth, shear angle, stress, and effective rake angle to build dynamic force model. A new dynamic surface generation model is developed by adding the wavy profile effect and workpiece material properties. The simulated surface profiles in diamond single cutting of different workpiece materials meet well with the experimental ones under different wavy profile patterns. Further studies are conducted to build turning force model and surface profile prediction model for single point diamond turning (SPDT) by adding the diamond-turned microtopography effect on the instantaneous cutting depth. Diamond single cutting experiment and diamond turning experiment are conducted to verify the developed dynamic models, which indicates that the predicted results including cutting force and surface profiles agree well with the experimental results.