Keyphrases
Copper Surface
100%
Droplet Evaporation
100%
Hybrid Nanofluid
100%
Cu-Al2O3
100%
New Analytical Model
100%
Nanofluid Droplet
87%
Evaporation Rate
37%
Droplet Evaporation Rate
25%
Size Effect
12%
Water Droplet
12%
Heat Transfer Rate
12%
Heat Dissipation
12%
High-temperature Heat Transfer
12%
Negligible Effects
12%
Latent Energy
12%
Thermal Fluid
12%
Cooling Method
12%
Cooling Capacity
12%
Spray Cooling
12%
Thermal Applications
12%
High Heat Flux Devices
12%
Succeeding
12%
High Evaporation Rate
12%
Engineering
Hybrid Nanofluid
100%
Analytical Model
100%
Evaporation Rate
75%
Heat Losses
12%
Heat Transfer Rate
12%
Cooling Capacity
12%
Thermal Fluid
12%
Negligible Effect
12%
Size Effect
12%
Heat Flux
12%
Chemical Engineering
Heat Flux
100%
Chilling
100%
Computer Science
Analytical Model
100%
Cooling Capacity
50%
Physics
Hybrid Nanofluid
100%
Chilling
12%