Drop impact: Fundamentals & impact characterisation of solder joints

E. H. Wong, R. Rajoo, Y. W. Mai, S. K.W. Seah, K. T. Tsai, L. M. Yap

Research output: Journal article publicationConference articleAcademic researchpeer-review

106 Citations (Scopus)

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Keyphrases

Engineering

Material Science