Drop impact: Fundamentals & impact characterisation of solder joints

E. H. Wong; R. Rajoo; Y. W. Mai; S. K.W. Seah; K. T. Tsai; L. M. Yap

doi:10.1109/ectc.2005.1441423

Drop impact: Fundamentals & impact characterisation of solder joints

E. H. Wong, R. Rajoo, Y. W. Mai, S. K.W. Seah, K. T. Tsai, L. M. Yap

Research output: Journal article publication › Conference article › Academic research › peer-review

106 Citations (Scopus)

Abstract

This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection stress. This is followed by a comprehensive study of the fracture characteristics of solder interconnections under high-speed impact using a newly developed Micro Impactor which provides both the fracture strength as well as fracture energy of impact. The test matrix consists of 5 solder alloys, 4 pad finishing, 3 thermal histories, and 2 solder mask designs forming a total of 120 combinations. The test has highlighted weakness in NSMD design and caution on SnAgCu solder when used in drop impact application.

Original language	English
Pages (from-to)	1202-1209
Number of pages	8
Journal	Proceedings - Electronic Components and Technology Conference
Volume	2
DOIs	https://doi.org/10.1109/ectc.2005.1441423
Publication status	Published - 2005
Externally published	Yes
Event	55th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States Duration: 31 May 2005 → 4 Jun 2005

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/ectc.2005.1441423

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title = "Drop impact: Fundamentals & impact characterisation of solder joints",

abstract = "This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection stress. This is followed by a comprehensive study of the fracture characteristics of solder interconnections under high-speed impact using a newly developed Micro Impactor which provides both the fracture strength as well as fracture energy of impact. The test matrix consists of 5 solder alloys, 4 pad finishing, 3 thermal histories, and 2 solder mask designs forming a total of 120 combinations. The test has highlighted weakness in NSMD design and caution on SnAgCu solder when used in drop impact application.",

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T2 - 55th Electronic Components and Technology Conference, ECTC

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AU - Rajoo, R.

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AU - Seah, S. K.W.

AU - Tsai, K. T.

AU - Yap, L. M.

PY - 2005

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AB - This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection stress. This is followed by a comprehensive study of the fracture characteristics of solder interconnections under high-speed impact using a newly developed Micro Impactor which provides both the fracture strength as well as fracture energy of impact. The test matrix consists of 5 solder alloys, 4 pad finishing, 3 thermal histories, and 2 solder mask designs forming a total of 120 combinations. The test has highlighted weakness in NSMD design and caution on SnAgCu solder when used in drop impact application.

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JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

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ER -

Drop impact: Fundamentals & impact characterisation of solder joints

Abstract

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