Dielectric properties of polyimide-mica hybrid films

Yi He Zhang, Zhi Min Dang, John Haozhong Xin, Walid A. Daoud, Jun Hui Ji, Yuyang Liu, Bin Fei, Yuanqing Li, Juntao Wu, Shiyong Yang, Lai Feng Li

Research output: Journal article publicationJournal articleAcademic researchpeer-review

49 Citations (Scopus)


Polyimide-mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N-dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical break-down strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI-mica hybrid films decreases with the increase of the mica content at temperatures from -150 to 150°C and at frequency range from 1 kHz to 1 MHz. It was found that the cryogenic electrical breakdown strength of the PI-mica hybrid films could meet the requirements of cryogenic insulating materials. KGaA, Weinheim.
Original languageEnglish
Pages (from-to)1473-1477
Number of pages5
JournalMacromolecular Rapid Communications
Issue number18
Publication statusPublished - 23 Sep 2005


  • Dielectric properties
  • Hybrid film
  • Polyimide-mica
  • Structure

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics
  • Materials Chemistry

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