Abstract
Polyimide-mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N-dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical break-down strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI-mica hybrid films decreases with the increase of the mica content at temperatures from -150 to 150°C and at frequency range from 1 kHz to 1 MHz. It was found that the cryogenic electrical breakdown strength of the PI-mica hybrid films could meet the requirements of cryogenic insulating materials. KGaA, Weinheim.
Original language | English |
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Pages (from-to) | 1473-1477 |
Number of pages | 5 |
Journal | Macromolecular Rapid Communications |
Volume | 26 |
Issue number | 18 |
DOIs | |
Publication status | Published - 23 Sept 2005 |
Keywords
- Dielectric properties
- Hybrid film
- Polyimide-mica
- Structure
ASJC Scopus subject areas
- Organic Chemistry
- Polymers and Plastics
- Materials Chemistry