Abstract
The fabrication processing, dielectric properties and thermal properties of polymer-matrix composites containing AlN particles (10μm) for electronic substrates and microelectronic packaging applications were investigated. The epoxy resin (E-51) is used as the matrix, and the dispersion of the AlN in the composites is varied form 0 vol% to 40 vol%. The microstructures of the polymer-matrix composites are observed through scanning electron microscopy (SEM). With increasing the AlN content, thermal conducting of composites is improved, while the composites still keep the relatively low dielectric constant and dielectric loss. According to the dielectric properties dependence on frequencies (1kHz-10MHz) of the composites, the Cole-Cole plot is analyzed. The dipole relaxation in the composite is induced, and it is suggested that the air layer exit between the epoxy resin and the AlN particles.
Original language | English |
---|---|
Pages (from-to) | 1053-1056 |
Number of pages | 4 |
Journal | Key Engineering Materials |
Volume | 334-335 II |
Publication status | Published - 21 Feb 2007 |
Keywords
- Dielectric property
- Epoxy reins
- Substrate material
- Thermal conductivity
ASJC Scopus subject areas
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering