TY - JOUR
T1 - Dielectric Metasurfaces Enabled Ultradensely Integrated Multidimensional Optical System
AU - Zhou, Hailong
AU - Wang, Yilun
AU - Gao, Xiaoyan
AU - Gao, Dingshan
AU - Dong, Jianji
AU - Huang, Dongmei
AU - Li, Feng
AU - Alexander Wai, Ping kong
AU - Zhang, Xinliang
N1 - Funding Information:
H.Z. and Y.W. contributed equally to this work. This work was partially supported by the National Key Research and Development Project of China (Nos. 2018YFB2201901 and 2019YFB2203102), the National Natural Science Foundation of China (Nos. 61805090, 62075075, 61927817, and 61735006,), Shenzhen Science and Technology Innovation Commission under grant (No. SGDX2019081623060558), and Research Grants Council of Hong Kong SAR (No. PolyU152241/18E). The device was fabricated at the Optoelectronic Micro & nano Fabrication and Characterizing Facility of Wuhan National Laboratory for Optoelectronics. We are immensely grateful to Jinwen Song and Pan Li for their help in the fabrication process.
Publisher Copyright:
© 2022 Wiley-VCH GmbH.
PY - 2022/4
Y1 - 2022/4
N2 - Metasurfaces consisted of subwavelength nanostructures can extremely interact with light and manipulate the characteristics of amplitude, phase, and polarization. In particular, on-chip dielectric metasurfaces have attracted significant attention for optical communication and computing, due to its compact footprint, low loss, and broad bandwidth. Herein, an ultradensely integrated multidimensional optical system with a footprint of only 20 × 30 µm2 based on inverse-designed dielectric metasurface network, incorporating mode-division multiplexing, and coherent optical communication technologies that can multiply the system capacity is demonstrated. It is assembled by the ultracompact multifunction on-chip metasurface devices, including four-mode demultiplexer, optical hybrid, crossing, and bending, which all have a size of only several micrometers. The inverse-designed work can significantly broaden the integrated device applications of on-chip metasurfaces and pave an alternative way for large-scale high-capacity optical communication system.
AB - Metasurfaces consisted of subwavelength nanostructures can extremely interact with light and manipulate the characteristics of amplitude, phase, and polarization. In particular, on-chip dielectric metasurfaces have attracted significant attention for optical communication and computing, due to its compact footprint, low loss, and broad bandwidth. Herein, an ultradensely integrated multidimensional optical system with a footprint of only 20 × 30 µm2 based on inverse-designed dielectric metasurface network, incorporating mode-division multiplexing, and coherent optical communication technologies that can multiply the system capacity is demonstrated. It is assembled by the ultracompact multifunction on-chip metasurface devices, including four-mode demultiplexer, optical hybrid, crossing, and bending, which all have a size of only several micrometers. The inverse-designed work can significantly broaden the integrated device applications of on-chip metasurfaces and pave an alternative way for large-scale high-capacity optical communication system.
KW - coherent optical communication
KW - dielectric metasurfaces
KW - mode-division multiplexing
KW - optical hybrid
KW - silicon photonics
UR - https://www.scopus.com/pages/publications/85123943740
U2 - 10.1002/lpor.202100521
DO - 10.1002/lpor.202100521
M3 - Journal article
AN - SCOPUS:85123943740
SN - 1863-8880
VL - 16
JO - Laser and Photonics Reviews
JF - Laser and Photonics Reviews
IS - 4
M1 - 2100521
ER -