Dielectric and thermal properties of polyimide-poly(ethylene oxide) nanofoamed films

Yi He Zhang, Li Yu, Li Hang Zhao, Wang Shu Tong, Haitao Huang, Shan Ming Ke, H. L.W. Chan

Research output: Journal article publicationJournal articleAcademic researchpeer-review

15 Citations (Scopus)


Polyimide nanofoamed films have been prepared by incorporating poly(ethylene oxide) (PEO) into poly(amide acid) (PAA) precursors with subsequent imidization of PAA precursors at high temperature. The porous structure, thermal decomposition temperature, and dielectric property of nanofoamed films were investigated by scanning electron microscopy, thermogravimetric analysis, and impedance spectroscopy. Nanopores with sizes around 40 nm to 200 nm were formed in nanofoamed films by pyrolysis of PEO during the imidization progress. The decomposition temperature of nanofoamed films decreased slightly with increasing volume fraction of nanopores and maintained the high decomposition temperature of 499.7 C when the volume fraction of nanopores was 10.9 %. The dielectric constant of nanofoamed films decreased from 3.4 for pure PI to 2.4 at 103Hz through the introduction of nanopores with volume fraction of 10.9 %.
Original languageEnglish
Pages (from-to)2281-2285
Number of pages5
JournalJournal of Electronic Materials
Issue number8
Publication statusPublished - 1 Aug 2012


  • composites
  • Dielectric properties
  • thermal properties
  • thin films

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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