Abstract
Silicons are used in both wafer fabrication and infrared optics. Direct machining of silicon single crystal was carried out on a precision lathe equipped with an air spindle to a finish of 2.86 nm rms roughness. The success of the turning process depends on optimizing the machining parameters such as feed rate, depth of cut, tool rake angles, the cutting lubricants and the crystallographic orientation of the crystal being cut. It is shown that the commercial production of an optical surface on brittle materials is made possible by single point diamond turning.
| Original language | English |
|---|---|
| Pages (from-to) | 42-48 |
| Number of pages | 7 |
| Journal | Journal of Materials Processing Technology |
| Volume | 73 |
| Issue number | 1-3 |
| DOIs | |
| Publication status | Published - 1 Jan 1998 |
Keywords
- Brittle materials
- Critical depth of cut
- Diamond turning
- Ductile-brittle transition
- Silicon single crystal
ASJC Scopus subject areas
- Ceramics and Composites
- Computer Science Applications
- Metals and Alloys
- Industrial and Manufacturing Engineering