Diamond turning of silicon substrates in ductile-regime

T. P. Leung, Wing Bun Lee, X. M. Lu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

134 Citations (Scopus)

Abstract

Silicons are used in both wafer fabrication and infrared optics. Direct machining of silicon single crystal was carried out on a precision lathe equipped with an air spindle to a finish of 2.86 nm rms roughness. The success of the turning process depends on optimizing the machining parameters such as feed rate, depth of cut, tool rake angles, the cutting lubricants and the crystallographic orientation of the crystal being cut. It is shown that the commercial production of an optical surface on brittle materials is made possible by single point diamond turning.
Original languageEnglish
Pages (from-to)42-48
Number of pages7
JournalJournal of Materials Processing Technology
Volume73
Issue number1-3
DOIs
Publication statusPublished - 1 Jan 1998

Keywords

  • Brittle materials
  • Critical depth of cut
  • Diamond turning
  • Ductile-brittle transition
  • Silicon single crystal

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

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