Diamond tool wear detection method using cutting force and its power spectrum analysis in ultra-precision fly cutting

G. Q. Zhang, Suet To

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

Cutting force and its power spectrum analysis was thought to be an effective method monitoring tool wear in many cutting processes and a significant body of research has been conducted on this research area. However, relative little similar research was found in ultra-precision fly cutting. In this paper, a group of experiments were carried out to investigate the cutting forces and its power spectrum characteristics under different tool wear stages. Result reveals that the cutting force increases with the progress of tool wear. The cutting force signals under different tool wear stages were analyzed using power spectrum analysis. The analysis indicates that a characteristic frequency does exist in the power spectrum of the cutting force, whose power spectral density increases with the increasing of tool wear level, this characteristic frequency could be adopted to monitor diamond tool wear in ultra-precision fly cutting.
Original languageEnglish
Title of host publication7th International Symposium on Advanced Optical Manufacturing and Testing Technologies
Subtitle of host publicationAdvanced Optical Manufacturing Technologies
PublisherSPIE
Volume9281
ISBN (Electronic)9781628413564
DOIs
Publication statusPublished - 1 Jan 2014
Event7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, AOMATT 2014 - Harbin International Conference Center, Harbin, China
Duration: 26 Apr 201429 Apr 2014

Conference

Conference7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, AOMATT 2014
Country/TerritoryChina
CityHarbin
Period26/04/1429/04/14

Keywords

  • cutting force
  • diamond tool wear
  • power spectrum analysis
  • Ultra-precision fly cutting

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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