Development of smart transducer with embedded sensor for automatic process control of ultrasonic wire bonding

Siu Wing Or, H.L.W. Chan, P.C.K. Liu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoeeramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.
Original languageEnglish
Pages (from-to)47-61
Number of pages15
JournalSmart Structures and Systems
Volume1
Issue number1
Publication statusPublished - 2005

Keywords

  • Lead zirconate titanate (PZT)
  • Piezoceramic
  • Ring sensor
  • Smart transducer
  • Ultrasonic wire bonder
  • Ultrasonic wire bonding
  • Automatic process control

ASJC Scopus subject areas

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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