Development of epoxy-matrix composite with both high-thermal conductivity and low-dielectric constant via hybrid filler systems

Kam Chuen Yung, B. L. Zhu, Tai Man Yue, C. S. Xie

Research output: Journal article publicationJournal articleAcademic researchpeer-review

40 Citations (Scopus)

Abstract

Materials used for printed circuit boards (PCBs) need to have more multifunctional properties, such as excellent thermal, electrical, and mechanical properties at the same time. Up to now, a sole polymer or single filler-filled polymer composites is hard to satisfy the demand for more multifunctional properties, especially to obtain high-thermal conductivity and low-dielectric constant (Dk) simultaneously. In this study, two hybrid filler systems [i.e., hollow glass microsphere (HGM) and aluminum nitride (AlN), HGM, and boron nitride (BN)] were filled into epoxy matrix in an attempt to reach a composite with high-thermal conductivity and low Dkat the same time. By varying the size, shape, and volume fraction of hybrid fillers, a new kind of epoxy-matrix composite both with high-thermal conductivity and low Dkas well as high-glass transition temperature (Tg) and low coefficient of thermal expansion (CTE) and dielectric loss factor (Df) were developed as candidate for future PCB markets. In addition, multiphase models describing the thermal conductivity and Dkwere developed, and suitable models were recommended for present materials system. copy; 2009 Wiley Periodicals, Inc.
Original languageEnglish
Pages (from-to)518-527
Number of pages10
JournalJournal of Applied Polymer Science
Volume116
Issue number1
DOIs
Publication statusPublished - 5 Apr 2010

Keywords

  • Coefficient of thermal expansion
  • Dielectric constant
  • Dielectric loss factor
  • Glass transition temperature
  • Hybrid filler
  • Polymer-matrix composites
  • Thermal conductivity

ASJC Scopus subject areas

  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry

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