Design and characterization of a micro strain gauge

Tommy C.P. Lo, Philip Ching Ho Chan, Zhenan Tang

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

Silicon piezoresistive stress sensors are used to measure stress on a plastic-encapsulated silicon die. These sensors are conventionally fabricated onto the surface of silicon integrated circuit die as part of the normal processing procedure. Since they can also be used over a wide temperature range after calibration, thermally-induced stresses can be measured. A four-point bending (4PB) stress fixture was used in calibration experiments. The result between the four-point resistance measurement and two-point resistance measurement of the strain gauges were compared. The problem in the calibration process was discussed.
Original languageEnglish
Title of host publicationIEEE Region 10 Annual International Conference, Proceedings/TENCON
PublisherIEEE
Pages36-39
Number of pages4
Publication statusPublished - 1 Dec 1995
Externally publishedYes
EventProceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95 - Hong Kong, Hong Kong
Duration: 6 Nov 199510 Nov 1995

Conference

ConferenceProceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95
Country/TerritoryHong Kong
CityHong Kong
Period6/11/9510/11/95

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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