Deposition of (Ti, Al)N films by filtered cathodic vacuum arc

Engineering

• Internal Stress 100%
• Hardness 66%
• Deposited Film 66%
• Nitride 33%
• Face-Centered Cubic 33%
• Ambient Temperature 33%
• Ray Diffraction 33%
• Microhardness 33%
• Partial Pressure 33%
• Preferred Orientation 33%
• Porous Film 33%
• Metal Phase 33%
• Crystal Structure 33%
• Surfaces 33%
• Substrates 33%
• Mechanical Properties 33%
• Roughness 33%
• Bends 33%

Material Science

• Young's Modulus 100%
• Hardness 100%
• Microhardness 50%
• Nitride Compound 50%
• Mechanical Property 50%
• Protective Atmosphere 50%
• X-Ray Diffraction 50%
• Crystal Structure 50%
• Surface Roughness 50%
• Metal 50%
• Temperature 50%
• Atomic Force Microscopy 50%

Physics

• Nitrogen 100%
• Pressure 100%
• Deposition 100%
• Vacuum 100%
• Increasing 37%
• Modulus of Elasticity 25%
• Strength of Materials 12%
• Surface Roughness 12%
• Ambient Temperature 12%
• Atomic Force Microscopy 12%
• Microhardness 12%
• X Ray Diffraction 12%
• Crystal Structure 12%
• Variations 12%
• Metal 12%
• Growth 12%
• Substrates 12%
• Planetary Atmosphere 12%
• Plane 12%