Delamination fracture mechanics of composite laminates with through-thickness pinning

Hong Yuan Liu, Yiu Wing Mai

Research output: Journal article publicationJournal articleAcademic researchpeer-review

6 Citations (Scopus)

Abstract

A theoretical model has been developed to investigate the effects of through-thickness pinning (z-pin) on mode I delamination. Computer simulation results are presented to understand the mechanism of z-pin reinforcement. Bridging force of the z-pin is calculated by a single pin pull-out model. Numerical results of the fracture load versus mode I delamination crack growth are obtained. Effects of the areal density, radius and Young’s modulus of z-pin are also studied. By assuming different interfacial friction coefficient, the effect of pin/laminates friction is discussed.

Original languageEnglish
Pages (from-to)139-146
Number of pages8
JournalStrength, Fracture and Complexity
Volume1
Issue number3
Publication statusPublished - 2003
Externally publishedYes

Keywords

  • Bridging force
  • Mode I delamination
  • Through-thickness pinning
  • Z-pin pull-out

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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