Effects of temperature and dosage on the evolution of extended defects during annealing of MeV ion-implanted Czochralski (CZ) p-type (001) silicon have been studied using transmission electron microscopy. Excess interstitials generated in a 1 × 1015cm-2/1.5 MeV B+implanted Si have been found to transform into extended interstitial (311) defects upon rapid thermal annealing at 800°C for 15 sec. During prolonged furnace annealing at 960°C for 1 h, some of the (311) defects grow longer at the expense of the smaller ones, and the average width of the defects seems to decrease at the same time. Formation of stable dislocation loops appears to occur only above a certain threshold annealing temperature (∼1000°C). The leakage current in diodes fabricated on 1.5 MeV B+implanted wafers was found to be higher for a dosage of 1 × 1014cm-2and less, as compared to those fabricated with a dosage of 5 × 1014cm-2and more. The difference in the observed leakage current has been attributed to the presence of dislocations in the active device region of the wafers that were implanted with the lower dosage.
- Boron implanted
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry