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Deep Convolution Network Based Super Resolution DOA Estimation with Toeplitz and Sparse Prior

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

In this paper, a deep learning (DL) based approach is investigated for direction-of-arrival (DOA) estimation, where large-scale uniform linear arrays (ULAs) and small number of samples are considered. Different from existing DL based DOA estimators, the proposed solution first exploits the Toeplitz prior of array covariance matrix and the linear shrinkage technique to obtain an enhanced sample covariance matrix (SCM), which is then formulated as a sparse linear representation (SLR) problem. Finally, a suitable deep convolution network (DCN) that learns such a SLR characteristic from large training dataset is designed. With aid of Toeplitz and sparse prior, the proposed solution can provide an increased resolution and estimation accuracy under the considered scenario, as verified by simulations.

Original languageEnglish
Title of host publication2024 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages8581-8585
Number of pages5
ISBN (Electronic)9798350344851
DOIs
Publication statusPublished - Apr 2024
Event49th IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2024 - Seoul, Korea, Republic of
Duration: 14 Apr 202419 Apr 2024

Publication series

NameICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings
ISSN (Print)1520-6149

Conference

Conference49th IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2024
Country/TerritoryKorea, Republic of
CitySeoul
Period14/04/2419/04/24

Keywords

  • deep convolution network
  • Direction of arrival estimation
  • sparse prior
  • Toeplitz prior

ASJC Scopus subject areas

  • Software
  • Signal Processing
  • Electrical and Electronic Engineering

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