Dark silicon-aware hardware-software collaborated design for heterogeneous many-core systems

Lei Yang, Weichen Liu, Nan Guan, Mengquan Li, Peng Chen, Edwin H.M. Sha

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

5 Citations (Scopus)

Abstract

ARM's big. LITTLE architecture coupled with Heterogeneous Multi-Processing (HMP) has enabled energy-efficient solutions in the dark silicon era. System-level techniques activate nonadjacent cores to eliminate chip thermal hotspot. However, it unexpectedly increases communication delay due to longer distance in network architectures, and in turn degrades application performance and system energy efficiency. In this paper, we present a novel hierarchical hardware-software collaborated approach to address the performance/temperature conflict in dark silicon many-core systems. Optimizations on interprocessor communication, application performance, chip temperature and energy consumption are well isolated and addressed in different phases. Evaluation results show that on average 22.57% reduction of communication latency, 23.04% improvement on energy efficiency and 6.11°C reduction of chip peak temperature are achieved compared with state-of-the-art techniques.
Original languageEnglish
Title of host publication2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
PublisherIEEE
Pages494-499
Number of pages6
ISBN (Electronic)9781509015580
DOIs
Publication statusPublished - 16 Feb 2017
Event22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 - Chiba, Japan
Duration: 16 Jan 201719 Jan 2017

Conference

Conference22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
CountryJapan
CityChiba
Period16/01/1719/01/17

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

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