Abstract
Direct measurement of the stress evolution is reported during reactive magnetron sputtering of WNx using a wafer curvature-based technique. It was found that the film stress changes significantly from compressive to tensile during crystallization. The nitrogen concentration in the films was determined by X-ray photoelectron spectroscopy.
Original language | English |
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Pages (from-to) | 1941-1943 |
Number of pages | 3 |
Journal | Journal of Materials Science Letters |
Volume | 19 |
Issue number | 21 |
DOIs | |
Publication status | Published - Nov 2000 |
Externally published | Yes |
ASJC Scopus subject areas
- General Materials Science