Skip to main navigation Skip to search Skip to main content

Crack growth study of a 3-D surface fracture under compression using strain and acoustic emission measurements

  • R. H C Wong
  • , T. C. Li
  • , Kam Tim Chau
  • , S. C. Li
  • , W. S. Zhu

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Fingerprint

Dive into the research topics of 'Crack growth study of a 3-D surface fracture under compression using strain and acoustic emission measurements'. Together they form a unique fingerprint.
Sort by

Keyphrases

Engineering

Material Science