Abstract
The development of predictive models for plate end debonding failures in beams strengthened with thin soffit plates is a topic of great practical relevance. After the early stress-based formulations, fracture mechanics approaches have become increasingly established. More recently, the cohesive zone (CZ) model has been successfully adopted as a bridge between the stress- and fracture mechanics-based treatments. However, the few studies of this nature propose complex formulations which can only be implemented numerically. To date, the only available analytical solution based on CZ modeling for the prediction of interfacial stresses/debonding in plated beams is limited to the determination of interfacial shear stresses and thus neglects the mixed-mode effects generated by the presence of interfacial normal stresses at the plate end. This paper presents a new analytical formulation based on the CZ modeling approach for the prediction of plate end debonding in plated beams. A key enhancement with respect to the previous solution is the use of a coupled mixed-mode CZ model, which enables a full account of mixed-mode effects at the plate end. The model describes the evolution of the interface after the end of the elastic regime, and predicts the value of the load at incipient debonding. The achievement of a closed-form solution for this quite complex case entails the introduction of a crucial simplifying assumption, as well as the ad hoc modeling of an effective cohesive interfacial response. The paper presents the analytical theory and compares its predictions with numerical and experimental results.
Original language | English |
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Pages (from-to) | 2477-2494 |
Number of pages | 18 |
Journal | International Journal of Solids and Structures |
Volume | 50 |
Issue number | 14-15 |
DOIs | |
Publication status | Published - 1 Jul 2013 |
Keywords
- Cohesive zone modeling
- Interfacial stresses
- Mixed-mode fracture
- Plate end debonding
- Plated beams
ASJC Scopus subject areas
- Modelling and Simulation
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Applied Mathematics