Coupled electromechanical fracture of piezoelectric ceramics subjected to transient thermal loads

B. L. Wang; Y. W. Mai

Coupled electromechanical fracture of piezoelectric ceramics subjected to transient thermal loads

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

Abstract

The surface fracture of a piezoelectric half-plane under transient thermal load is studied. The transient temperature and the stress distributions in an un-cracked medium are calculated. The stress and the electric displacement for un-cracked medium are used as the crack surface traction and electric charge with opposite sign to formulate the mixed boundary value problem. Results for stress and electric displacement intensity factors are computed as a function of the normalized time and the crack size. The crack propagation behavior is discussed.

Original language	English
Title of host publication	Mechanics of Electromagnetic Material Systems and Structures
Editors	Y. Shindo
Publisher	WIT Press
Pages	115-125
Number of pages	11
ISBN (Print)	1853129208
Publication status	Published - 2003
Externally published	Yes
Event	Mechanics of Electromagnetic Material Systems and Structures - Blacksburg, VA, United States Duration: 23 Jun 2003 → 28 Jun 2003

Conference

Conference	Mechanics of Electromagnetic Material Systems and Structures
Country/Territory	United States
City	Blacksburg, VA
Period	23/06/03 → 28/06/03

ASJC Scopus subject areas

General Engineering

Cite this

@inproceedings{75aec9eeb3f34e6693a56fccb0c427b0,

title = "Coupled electromechanical fracture of piezoelectric ceramics subjected to transient thermal loads",

abstract = "The surface fracture of a piezoelectric half-plane under transient thermal load is studied. The transient temperature and the stress distributions in an un-cracked medium are calculated. The stress and the electric displacement for un-cracked medium are used as the crack surface traction and electric charge with opposite sign to formulate the mixed boundary value problem. Results for stress and electric displacement intensity factors are computed as a function of the normalized time and the crack size. The crack propagation behavior is discussed.",

author = "Wang, {B. L.} and Mai, {Y. W.}",

year = "2003",

language = "English",

isbn = "1853129208",

pages = "115--125",

editor = "Y. Shindo",

booktitle = "Mechanics of Electromagnetic Material Systems and Structures",

publisher = "WIT Press",

address = "United Kingdom",

note = "Mechanics of Electromagnetic Material Systems and Structures ; Conference date: 23-06-2003 Through 28-06-2003",

}

Coupled electromechanical fracture of piezoelectric ceramics subjected to transient thermal loads. / Wang, B. L.; Mai, Y. W.
Mechanics of Electromagnetic Material Systems and Structures. ed. / Y. Shindo. WIT Press, 2003. p. 115-125.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

TY - GEN

T1 - Coupled electromechanical fracture of piezoelectric ceramics subjected to transient thermal loads

AU - Wang, B. L.

AU - Mai, Y. W.

PY - 2003

Y1 - 2003

N2 - The surface fracture of a piezoelectric half-plane under transient thermal load is studied. The transient temperature and the stress distributions in an un-cracked medium are calculated. The stress and the electric displacement for un-cracked medium are used as the crack surface traction and electric charge with opposite sign to formulate the mixed boundary value problem. Results for stress and electric displacement intensity factors are computed as a function of the normalized time and the crack size. The crack propagation behavior is discussed.

AB - The surface fracture of a piezoelectric half-plane under transient thermal load is studied. The transient temperature and the stress distributions in an un-cracked medium are calculated. The stress and the electric displacement for un-cracked medium are used as the crack surface traction and electric charge with opposite sign to formulate the mixed boundary value problem. Results for stress and electric displacement intensity factors are computed as a function of the normalized time and the crack size. The crack propagation behavior is discussed.

UR - http://www.scopus.com/inward/record.url?scp=3543103772&partnerID=8YFLogxK

M3 - Conference article published in proceeding or book

AN - SCOPUS:3543103772

SN - 1853129208

SP - 115

EP - 125

BT - Mechanics of Electromagnetic Material Systems and Structures

A2 - Shindo, Y.

PB - WIT Press

T2 - Mechanics of Electromagnetic Material Systems and Structures

Y2 - 23 June 2003 through 28 June 2003

ER -

Coupled electromechanical fracture of piezoelectric ceramics subjected to transient thermal loads

Abstract

Conference

ASJC Scopus subject areas

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