Correlating interconnect stress test and accelerated thermal cycling for accessing the reliabilities of high performance printed circuit boards

Kam Chuen Yung, Hai Ming Liem, Henry H.S. Choy, Yuen Wah Man

Research output: Journal article publicationJournal articleAcademic researchpeer-review

3 Citations (Scopus)

Abstract

Understanding the failure mechanism of a plated through hole (PTH) is essential for a complete picture of their life span, and hence for the continued electronic reliability prediction and development of high performance printed circuit boards. This paper presents the efficacy of establishing a correlation between interconnect stress test (IST) and accelerated thermal cycling (ATC) data on standard high performance coupons. In accord with the observation in PTH micro-sectioning, a PTH failure mechanism is proposed based on the thermal expansion-induced shearing at the copper-resin interface. The PTH cycle to failure data from the two methodologies, IST and ATC, are correlated. In terms of the glass transition temperature, a linear relationship exists between two different data sets. It is also demonstrated that the base material thermal property and PTH sizes are the two essential factors determining the reliability of a PTH. Furthermore, a life stress model is created to predict the life time of a coupon at a particular temperature level.
Original languageEnglish
Article number6119132
Pages (from-to)2005-2017
Number of pages13
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume1
Issue number12
DOIs
Publication statusPublished - 1 Dec 2011

Keywords

  • Accelerated thermal cycling
  • cycle to failure
  • interconnect stress test
  • plated through hole
  • printed circuit board

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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