Copper direct drilling with tea CO2laser in manufacture of high-density interconnection printed circuit board

Xiang Yi Fang; Kam Chuen Yung

doi:10.1109/TEPM.2006.882868

Copper direct drilling with tea CO₂laser in manufacture of high-density interconnection printed circuit board

Xiang Yi Fang
, Kam Chuen Yung

Research output: Journal article publication › Journal article › Academic research › peer-review

11 Citations (Scopus)

Abstract

A method for copper direct drilling by carbon dioxide CO2laser was investigated for efficient microvia formation on the copper conducting layer of high-density interconnection (HDI) of printed circuit board (PCB). A metal-tin layer was coated on the surface of copper conductor foil to enhance the CO2laser energy adsorption on it. The coated surfaces were then drilled by a CO2laser with various pulse energies. The microvia holes were efficiently formed in good quality with one laser pulse on 9-μm -thick polished copper conducting layer. The laser energy absorption of coated copper foils was approximately calculated. The experimental results demonstrated the potential application of the developed method in high-density interconnection printed circuit board manufacturing.

Original language	English
Pages (from-to)	145-149
Number of pages	5
Journal	IEEE Transactions on Electronics Packaging Manufacturing
Volume	29
Issue number	3
DOIs	https://doi.org/10.1109/TEPM.2006.882868
Publication status	Published - 1 Jul 2006

Keywords

CO laser drilling 2
High-density interconnection
Printed circuit board (PCB) manufacturing

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

More information

10.1109/TEPM.2006.882868

Cite this

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abstract = "A method for copper direct drilling by carbon dioxide CO2laser was investigated for efficient microvia formation on the copper conducting layer of high-density interconnection (HDI) of printed circuit board (PCB). A metal-tin layer was coated on the surface of copper conductor foil to enhance the CO2laser energy adsorption on it. The coated surfaces were then drilled by a CO2laser with various pulse energies. The microvia holes were efficiently formed in good quality with one laser pulse on 9-μm -thick polished copper conducting layer. The laser energy absorption of coated copper foils was approximately calculated. The experimental results demonstrated the potential application of the developed method in high-density interconnection printed circuit board manufacturing.",

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AB - A method for copper direct drilling by carbon dioxide CO2laser was investigated for efficient microvia formation on the copper conducting layer of high-density interconnection (HDI) of printed circuit board (PCB). A metal-tin layer was coated on the surface of copper conductor foil to enhance the CO2laser energy adsorption on it. The coated surfaces were then drilled by a CO2laser with various pulse energies. The microvia holes were efficiently formed in good quality with one laser pulse on 9-μm -thick polished copper conducting layer. The laser energy absorption of coated copper foils was approximately calculated. The experimental results demonstrated the potential application of the developed method in high-density interconnection printed circuit board manufacturing.

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