Copper direct drilling with tea CO2laser in manufacture of high-density interconnection printed circuit board

Xiang Yi Fang, Kam Chuen Yung

Research output: Journal article publicationJournal articleAcademic researchpeer-review

5 Citations (Scopus)

Abstract

A method for copper direct drilling by carbon dioxide CO2laser was investigated for efficient microvia formation on the copper conducting layer of high-density interconnection (HDI) of printed circuit board (PCB). A metal-tin layer was coated on the surface of copper conductor foil to enhance the CO2laser energy adsorption on it. The coated surfaces were then drilled by a CO2laser with various pulse energies. The microvia holes were efficiently formed in good quality with one laser pulse on 9-μm -thick polished copper conducting layer. The laser energy absorption of coated copper foils was approximately calculated. The experimental results demonstrated the potential application of the developed method in high-density interconnection printed circuit board manufacturing.
Original languageEnglish
Pages (from-to)145-149
Number of pages5
JournalIEEE Transactions on Electronics Packaging Manufacturing
Volume29
Issue number3
DOIs
Publication statusPublished - 1 Jul 2006

Keywords

  • CO laser drilling 2
  • High-density interconnection
  • Printed circuit board (PCB) manufacturing

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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