Convective heat transfer from simulated air-cooled printed-circuit board assembly on horizontal or vertical orientation

Keyphrases

• Convective Heat Transfer 100%
• Printed Circuit Board Assembly 100%
• Air-cooled 100%
• Vertical Orientation 100%
• Horizontal Orientation 100%
• Reynolds number 66%
• Rib Height 66%
• Rib Width 66%
• Convection 33%
• Airflow 33%
• Numerical Analysis 33%
• Vertical Position 33%
• Height Ratio 33%
• Height-to-width Ratio 33%
• Streamwise 33%
• Horizontal Position 33%
• Heat Transfer Measurement 33%
• Predictive Correlations 33%
• Rectangular Duct Flow 33%

Engineering

• Convective 100%
• Printed Circuit Board 100%
• Reynolds' Number 66%
• Duct 66%
• Experimental Investigation 33%
• Streamwise 33%
• Rectangular Duct 33%
• Air Flow 33%
• Thermodynamics 33%