Connected component labeling on a one dimensional DSP array

M. F. Ercan; Yu Fai Fung

doi:10.1109/TENCON.1999.818667

Connected component labeling on a one dimensional DSP array

M. F. Ercan, Yu Fai Fung

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

6 Citations (Scopus)

Abstract

This paper presents a parallel implementation of connected component labeling algorithms for gray and binary images on a one-dimensional DSP array. The system is a distributed memory MIMD and all the algorithms are developed considering this platform. Performance results of several parallel connected component labeling methods are evaluated. The multi-DSP system has demonstrated a viable performance.

Original language	English
Title of host publication	IEEE Region 10 Annual International Conference, Proceedings/TENCON
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1299-1302
Number of pages	4
ISBN (Electronic)	0780357396, 9780780357396
DOIs	https://doi.org/10.1109/TENCON.1999.818667
Publication status	Published - Sept 1999
Event	1999 IEEE Region 10 Conference, TENCON 1999 - Cheju Island, Korea, Republic of Duration: 15 Sept 1999 → 17 Sept 1999

Publication series

Name	IEEE Region 10 Annual International Conference, Proceedings/TENCON
Volume	2
ISSN (Print)	2159-3442
ISSN (Electronic)	2159-3450

Conference

Conference	1999 IEEE Region 10 Conference, TENCON 1999
Country/Territory	Korea, Republic of
City	Cheju Island
Period	15/09/99 → 17/09/99

ASJC Scopus subject areas

Computer Science Applications
Electrical and Electronic Engineering

More information

10.1109/TENCON.1999.818667

Cite this

Ercan, M. F., & Fung, Y. F. (1999). Connected component labeling on a one dimensional DSP array. In IEEE Region 10 Annual International Conference, Proceedings/TENCON (pp. 1299-1302). Article 818667 (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.1999.818667

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Ercan, MF & Fung, YF 1999, Connected component labeling on a one dimensional DSP array. in IEEE Region 10 Annual International Conference, Proceedings/TENCON., 818667, IEEE Region 10 Annual International Conference, Proceedings/TENCON, vol. 2, Institute of Electrical and Electronics Engineers Inc., pp. 1299-1302, 1999 IEEE Region 10 Conference, TENCON 1999, Cheju Island, Korea, Republic of, 15/09/99. https://doi.org/10.1109/TENCON.1999.818667

Connected component labeling on a one dimensional DSP array. / Ercan, M. F.; Fung, Yu Fai.
IEEE Region 10 Annual International Conference, Proceedings/TENCON. Institute of Electrical and Electronics Engineers Inc., 1999. p. 1299-1302 818667 (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2).

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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Connected component labeling on a one dimensional DSP array

Abstract

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