Concurrent mold and process design of transfer molding for electronic packages using process simulation and design of experiments techniques

K.W. Ip; Chun Kit Kwong

Concurrent mold and process design of transfer molding for electronic packages using process simulation and design of experiments techniques

K.W. Ip, Chun Kit Kwong

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research

Original language	English
Pages	145-151
Number of pages	7
Publication status	Published - 2002
Event	ISPE International Conference on Concurrent Engineering - Duration: 1 Jan 2002 → …

Conference

Conference	ISPE International Conference on Concurrent Engineering
Period	1/01/02 → …

Cite this

@conference{cb882013e28c423c85609a234c82c152,

title = "Concurrent mold and process design of transfer molding for electronic packages using process simulation and design of experiments techniques",

author = "K.W. Ip and Kwong, {Chun Kit}",

year = "2002",

language = "English",

pages = "145--151",

note = "ISPE International Conference on Concurrent Engineering ; Conference date: 01-01-2002",

}

Concurrent mold and process design of transfer molding for electronic packages using process simulation and design of experiments techniques. / Ip, K.W.; Kwong, Chun Kit.
2002. 145-151 Paper presented at ISPE International Conference on Concurrent Engineering.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research

TY - CONF

T1 - Concurrent mold and process design of transfer molding for electronic packages using process simulation and design of experiments techniques

AU - Ip, K.W.

AU - Kwong, Chun Kit

PY - 2002

Y1 - 2002

M3 - Conference presentation (not published in journal/proceeding/book)

SP - 145

EP - 151

T2 - ISPE International Conference on Concurrent Engineering

Y2 - 1 January 2002

ER -