Complete thin film mechanical characterization using picosecond ultrasonics and nanostructured transducers: Experimental demonstration on SiO2

P. A. Mante, J. F. Robillard, A. Devos

Research output: Journal article publicationJournal articleAcademic researchpeer-review

44 Citations (Scopus)

Abstract

Complete mechanical measurements are performed in submicron films using the picosecond ultrasonic technique. The Al layer deposited on the top of the sample acting as a transducer is replaced with a nanostructured Al film. Using an usual picosecond ultrasonic setup we can excite and detect high-frequency longitudinal and surface acoustic waves. From this we can deduce Young's modulus and Poisson's ratio of any isotropic thin film. Experimental results obtained for a thin silica layer on silicon are in very good agreement with literature.

Original languageEnglish
Article number071909
JournalApplied Physics Letters
Volume93
Issue number7
DOIs
Publication statusPublished - 1 Sept 2008
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Fingerprint

Dive into the research topics of 'Complete thin film mechanical characterization using picosecond ultrasonics and nanostructured transducers: Experimental demonstration on SiO2'. Together they form a unique fingerprint.

Cite this