Comparison of interfacial and electrical characteristics of HfO2and HfAlO high-k dielectrics on compressively strained Si1-xGex

K. K.S. Curreem, P. F. Lee, K. S. Wong, J. Y. Dai, M. J. Zhou, J. Wang, Quan Li

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39 Citations (Scopus)


Interfacial reactions and electrical properties of Hf O2 and HfAlO high- k gate dielectric films on strained Si1-x Gex (x=17%) fabricated by pulsed-laser deposition were investigated. The dielectric films were characterized by x-ray photoelectron spectroscopy, transmission electron microscopy, and electrical measurements. We found that alloying of Hf O2 with alumina can reduce the Ge Ox formation at the interfacial layer and thus reduce the Ge diffusion during the film post-thermal annealing process. Such suppression effect significantly improved the electrical properties of the dielectric films.
Original languageEnglish
Article number182905
JournalApplied Physics Letters
Issue number18
Publication statusPublished - 1 May 2006

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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