CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Xin Li, Yinggang Wang, Hongyu Chen, Wenhong Zhao, Qianfa Deng, Tengfei Yin, Suet To, Zhe Sun, Xi Shen, Wei Hang (Corresponding Author), Julong Yuan

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

In this study, in order to improve and restore the performance of the polishing pads and reduce the cost of chemical mechanical polishing, three types of material polishing pads, namely, polyurethane, damping cloth, and non-woven fabric, were selected for the experiment. Accordingly, each polishing pad was set up with diamond conditioner and high-pressure micro-jet (HPMJ) conditioning control experiments. Subsequently, the fluctuation ranges of the material removal rate on the three polishing pads were 2.73–3.75 μm/h, 1.38–1.99 μm/h, and 2.36–4.32 μm/h, respectively under the HPMJ conditioning method, while the fluctuation ranges of the material removal rate on the three polishing pads were 1.80–4.14 μm/h, 1.02–2.09 μm/h, and 1.78–5.88 μm/h under the diamond conditioning method. Comparing the polishing pad morphologies under SEM, we observed that the surface of the polishing pad after HPMJ conditioning was relatively clean, and the hole structure was not blocked. Contrastingly, there remained numerous abrasive particles on the surface after the conventional diamond conditioning and the hole structure was blocked. Thus, the HPMJ conditioning technology is better than the traditional diamond conditioning technology. Subsequently, the polishing pad after HPMJ conditioning has a longer service life and a more stable material removal rate than that after traditional diamond conditioning.

Original languageEnglish
Article number200
Number of pages11
JournalMicromachines
Volume14
Issue number1
DOIs
Publication statusPublished - Jan 2023

Keywords

  • chemical mechanical polishing
  • conditioning
  • high-pressure micro-jet
  • polishing pad
  • wear

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'CMP Pad Conditioning Using the High-Pressure Micro-Jet Method'. Together they form a unique fingerprint.

Cite this