CHARACTERIZATION OF THIN-FILM ADHESION WITH THE SCANNING ACOUSTIC MICROSCOPE. .

R. C. Addison, Michael Geoffrey Somekh, J. M. Rowe, G. A D Briggs

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

2 Citations (Scopus)

Abstract

Films and coatings are integral elements of devices used for a variety of purposes in engineering, electronic, optical and other applications. The performance, functional characteristics, and structural properties of the devices all depend on the adhesion between the film and substrate. Adhesion measurement techniques that are currently available are not comparable from one laboratory to another, nor are there any techniques that are noncontacting, quantitative, and reliable. In our work, surface acoustic waves (SAWs) are used to introduce stresses between the films and their substrates. Regions of the film having weak bonding forces will produce a different response than the regions having strong bonding forces.
Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSPIE
Pages275-284
Number of pages10
Volume768
ISBN (Print)0892528036
Publication statusPublished - 1 Dec 1987
Externally publishedYes
EventInternational Symposium on Pattern Recognition and Acoustical Imaging. - Newport Beach, CA, United States
Duration: 1 Dec 1987 → …

Conference

ConferenceInternational Symposium on Pattern Recognition and Acoustical Imaging.
CountryUnited States
CityNewport Beach, CA
Period1/12/87 → …

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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