CHARACTERIZATION OF THIN-FILM ADHESION WITH THE SCANNING ACOUSTIC MICROSCOPE. .

R. C. Addison; Michael Geoffrey Somekh; J. M. Rowe; G. A D Briggs

CHARACTERIZATION OF THIN-FILM ADHESION WITH THE SCANNING ACOUSTIC MICROSCOPE. .

R. C. Addison, Michael Geoffrey Somekh, J. M. Rowe, G. A D Briggs

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

2 Citations (Scopus)

Abstract

Films and coatings are integral elements of devices used for a variety of purposes in engineering, electronic, optical and other applications. The performance, functional characteristics, and structural properties of the devices all depend on the adhesion between the film and substrate. Adhesion measurement techniques that are currently available are not comparable from one laboratory to another, nor are there any techniques that are noncontacting, quantitative, and reliable. In our work, surface acoustic waves (SAWs) are used to introduce stresses between the films and their substrates. Regions of the film having weak bonding forces will produce a different response than the regions having strong bonding forces.

Original language	English
Title of host publication	Proceedings of SPIE - The International Society for Optical Engineering
Publisher	SPIE
Pages	275-284
Number of pages	10
Volume	768
ISBN (Print)	0892528036
Publication status	Published - 1 Dec 1987
Externally published	Yes
Event	International Symposium on Pattern Recognition and Acoustical Imaging. - Newport Beach, CA, United States Duration: 1 Dec 1987 → …

Conference

Conference	International Symposium on Pattern Recognition and Acoustical Imaging.
Country/Territory	United States
City	Newport Beach, CA
Period	1/12/87 → …

ASJC Scopus subject areas

Electrical and Electronic Engineering
Condensed Matter Physics

Cite this

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title = "CHARACTERIZATION OF THIN-FILM ADHESION WITH THE SCANNING ACOUSTIC MICROSCOPE. .",

abstract = "Films and coatings are integral elements of devices used for a variety of purposes in engineering, electronic, optical and other applications. The performance, functional characteristics, and structural properties of the devices all depend on the adhesion between the film and substrate. Adhesion measurement techniques that are currently available are not comparable from one laboratory to another, nor are there any techniques that are noncontacting, quantitative, and reliable. In our work, surface acoustic waves (SAWs) are used to introduce stresses between the films and their substrates. Regions of the film having weak bonding forces will produce a different response than the regions having strong bonding forces.",

author = "Addison, {R. C.} and Somekh, {Michael Geoffrey} and Rowe, {J. M.} and Briggs, {G. A D}",

year = "1987",

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publisher = "SPIE",

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note = "International Symposium on Pattern Recognition and Acoustical Imaging. ; Conference date: 01-12-1987",

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CHARACTERIZATION OF THIN-FILM ADHESION WITH THE SCANNING ACOUSTIC MICROSCOPE. . / Addison, R. C.; Somekh, Michael Geoffrey; Rowe, J. M. et al.
Proceedings of SPIE - The International Society for Optical Engineering. Vol. 768 SPIE, 1987. p. 275-284.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AU - Somekh, Michael Geoffrey

AU - Rowe, J. M.

AU - Briggs, G. A D

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N2 - Films and coatings are integral elements of devices used for a variety of purposes in engineering, electronic, optical and other applications. The performance, functional characteristics, and structural properties of the devices all depend on the adhesion between the film and substrate. Adhesion measurement techniques that are currently available are not comparable from one laboratory to another, nor are there any techniques that are noncontacting, quantitative, and reliable. In our work, surface acoustic waves (SAWs) are used to introduce stresses between the films and their substrates. Regions of the film having weak bonding forces will produce a different response than the regions having strong bonding forces.

AB - Films and coatings are integral elements of devices used for a variety of purposes in engineering, electronic, optical and other applications. The performance, functional characteristics, and structural properties of the devices all depend on the adhesion between the film and substrate. Adhesion measurement techniques that are currently available are not comparable from one laboratory to another, nor are there any techniques that are noncontacting, quantitative, and reliable. In our work, surface acoustic waves (SAWs) are used to introduce stresses between the films and their substrates. Regions of the film having weak bonding forces will produce a different response than the regions having strong bonding forces.

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M3 - Conference article published in proceeding or book

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EP - 284

BT - Proceedings of SPIE - The International Society for Optical Engineering

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T2 - International Symposium on Pattern Recognition and Acoustical Imaging.

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CHARACTERIZATION OF THIN-FILM ADHESION WITH THE SCANNING ACOUSTIC MICROSCOPE. .

Abstract

Conference

ASJC Scopus subject areas

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