Characterization of surface topography variation in the ultra-precision tool servo-based diamond cutting of 3D microstructured surfaces

Wei Yuan, Chi Fai Cheung

Research output: Journal article publicationJournal articleAcademic researchpeer-review

1 Citation (Scopus)

Abstract

Previous models of the relative tool-work vibration are not generalized to represent the surface generation mechanism in the ultra-precision tool servo-based diamond cutting (UTSDC) of three-dimensional (3D) microstructured surfaces. This is due to the fact that the tool-work vibration in UTSDC is no longer a steady harmonic vibration with a constant amplitude but is influenced by the tool motion along the thrust direction. In this paper, dynamic modeling of the cutting system is presented for the characterization of surface topography variation in UTSDC of a microlens array considering the tool-work vibration as an underdamped vibration. The natural frequency and damping ratio of the cutting system are determined by the data-dependent systems (DDS) method. Based on the analysis of the surface profile and cutting force signals, it is found that the tool-work vibration is significantly enhanced in the cut-in process when the cutting speed increases. The simulation results show that the proposed dynamic model can well-determine root-mean-squares RMS values of the surface primary profile and the dynamic force acting on the force sensor. The dynamic model provides insight into the formation of the surface topography variation in UTSDC of 3D microstructured surfaces, and the model might be applied in self-optimized machining systems in the future.

Original languageEnglish
Article number1448
JournalMicromachines
Volume12
Issue number12
DOIs
Publication statusPublished - Dec 2021

Keywords

  • Cutting forces
  • Data-dependent systems
  • Dynamic modeling
  • Microlens array
  • Microstructured surfaces
  • Surface characterization
  • Surface topography variation
  • Tool servo diamond cutting
  • Ultra-precision machining

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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