Characterization of motion artifacts from the interfacial instability of textile electrodes and skin using a simulated method

Peng Jun Xu, Faming Wang, Hao Liu, Xiaoming Tao

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

An objective method to evaluate the motion artifacts of textile electrodes was presented using a self-made apparatus. The apparatus simulates skin-electrode mechanical interaction by controlling electrodes moving on a volume conductor with various speed and contact pressure. Three different types of electrodes was characterized and the motion induced electrical noise (Eocp) of a pair of the same structural electrodes were recorded, peak-to-peak of the noise (ΔEocp) was calculated for evaluating the amplitude of motion artifacts. The results shown that motion artifacts decreased with increased movement speed and contact pressure. For textile electrodes, woven plain structure exhibits the minimum motion artifacts.
Original languageEnglish
Title of host publicationTextile Bioengineering and Informatics Symposium Proceedings 2016 - 9th Textile Bioengineering and Informatics Symposium, TBIS 2016, in conjunction with the 6th Asian Protective Clothing Conference, APCC 2016
PublisherBinary Information Press
Pages887-894
Number of pages8
Publication statusPublished - 1 Jan 2016
Event9th Textile Bioengineering and Informatics Symposium, TBIS 2016, in conjunction with the 6th Asian Protective Clothing Conference, APCC 2016 - RMIT University, Melbourne, Australia
Duration: 12 Jul 201615 Jul 2016

Conference

Conference9th Textile Bioengineering and Informatics Symposium, TBIS 2016, in conjunction with the 6th Asian Protective Clothing Conference, APCC 2016
CountryAustralia
CityMelbourne
Period12/07/1615/07/16

Keywords

  • Electrocardiogram (ECG)
  • Interfacial instability
  • Motion artifacts
  • Open Circuit Potential (OCP)
  • Textile electrodes

ASJC Scopus subject areas

  • Biomaterials
  • Bioengineering

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