Characteristics of chip generation by vertical elliptic ultrasonic vibration-assisted grinding of brittle materials

Y. Peng, Z. Liang, Y. Wu, Y. Guo, C. Wang

Research output: Journal article publicationJournal articleAcademic researchpeer-review

27 Citations (Scopus)

Abstract

Elliptic ultrasonic vibration-assisted grinding has been proven to be a high-efficiency machining technique for some brittle materials. This paper aims to investigate the chip generating characteristics in grinding of brittle materials with vertical elliptic vibration assistance. Vertical elliptic ultrasonic vibration-assisted grinding for precision machining brittle polysilicon is suggested and tested. The mechanism of chip generation and characteristics of surfaces in ductile mode, machined by ultrasonic vibration-assisted grinding, are investigated. As a result, when microgrinding by ultrasonic vibration, it was confirmed that the continuous chips generated by ductile mode can be more easily be fully developed.

Original languageEnglish
Pages (from-to)563-568
Number of pages6
JournalInternational Journal of Advanced Manufacturing Technology
Volume62
Issue number5-8
DOIs
Publication statusPublished - Sept 2012
Externally publishedYes

Keywords

  • Chip
  • Ductile
  • Elliptic vibration-assisted grinding
  • Surface roughness

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Mechanical Engineering
  • Computer Science Applications
  • Industrial and Manufacturing Engineering

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