Abstract
Three key advances in device technology must be made to realize the potential of carbon nanotube transistors: (1) aligned CNT density of ≥200 CNT/μm on a wafer scale, (2) stable p- and n-type doping on the same wafer with control over the doping level, (3) low resistance metal to CNT contact at short (<20 nm) contact length. CNFET technology has now advanced to a point where large scale circuit level demonstration can be contemplated. This is made possible by advances in wafer-scale CNT growth, multiple CNT transfer, and imperfection-immune design techniques to overcome mis-positioned CNTs [11] and m-CNTs (e.g. VMR [18-19] and ACCNT [27]). In order to minimize CNT-specific variations (e.g. CNT count variations [45]), circuit design techniques co-optimized with process technology will play an important role. In the near future, CNFET circuit performance demonstration at GHz clock speed with the requisite device density is expected.
Original language | English |
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Title of host publication | 2011 International Electron Devices Meeting, IEDM 2011 |
DOIs | |
Publication status | Published - 1 Dec 2011 |
Externally published | Yes |
Event | 2011 IEEE International Electron Devices Meeting, IEDM 2011 - Washington, DC, United States Duration: 5 Dec 2011 → 7 Dec 2011 |
Conference
Conference | 2011 IEEE International Electron Devices Meeting, IEDM 2011 |
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Country/Territory | United States |
City | Washington, DC |
Period | 5/12/11 → 7/12/11 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry