Abstract
A sealed plate is essential for protecting the sample processing inside biochip from the environment and it can be attained through bonding. Bonding technology in silicon and glass are well-developed in the past decades; however, bonding in polymers is still challenging. Issues such as micropattern integrity, contamination and bonding efficiency are important criteria for plastic bonding. In this work, a new bonding method combining the advantages of thermal bonding (homogeneous bonding) and microwave bonding (high fusion efficiency and low energy consumption) has been developed which allows the biochip manufacturing to be more scalable. It features with simple equipment setup, low material and running costs. Given the strong dielectric properties [1-4], carbon nanotubes (CNTs) were used as effective microwave absorber in this bonding system. A desirable bonding result has been obtained as shown in this paper.
Original language | English |
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Title of host publication | Proceedings of the 7th IASTED International Conference on Biomedical Engineering, BioMED 2010 |
Pages | 131-133 |
Number of pages | 3 |
Volume | 2 |
Publication status | Published - 1 Dec 2010 |
Event | 7th IASTED International Conference on Biomedical Engineering, BioMED 2010 - Innsbruck, Austria Duration: 17 Feb 2010 → 19 Feb 2010 |
Conference
Conference | 7th IASTED International Conference on Biomedical Engineering, BioMED 2010 |
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Country/Territory | Austria |
City | Innsbruck |
Period | 17/02/10 → 19/02/10 |
Keywords
- Biochip
- Carbon nanotubes
- Microtechnology and bioMEMS
- Polymeric bonding
ASJC Scopus subject areas
- Biomedical Engineering
- Medicine (miscellaneous)