TY - GEN
T1 - Autostereoscopic Measurement System for Rapid 3D Inspection of Wire Bonding
AU - Gao, Sanshan
AU - Cheung, Chi Fai
AU - Li, Da
N1 - Funding Information:
ACKNOWLEDGMENT The work described in this paper was mainly supported by a grant from the Ministry of Science and Technology of China (Project Code: 2017YFE0191300) and a grant from the Research Grants Council of the Government of the Hong Kong Special Administrative Region, China (Project No. 15202315). The authors would also like to express their sincere thanks to the Research Committee of The Hong Kong Polytechnic University for their financial support of the project through a PhD studentship (project account code: RK2G).
Publisher Copyright:
© 2021 IEEE.
PY - 2021/8/27
Y1 - 2021/8/27
N2 - The quality of wire bonding is an important factor in the manufacturing of various precision electronic components in semiconductor industry. The wire bonding defects, including high loop and low loop, determined by the bonding height information, inevitably affect the performance of the product. It is vital to measure height information quickly and accurately to reduce the failure rate in the manufacturing process. However, traditional measurement system often needs to move the target samples for a number of times. To address the key measurement problems, a three-dimensional (3D) optical measurement system is developed based on autostereoscopy technologies. A micro-lens array is used to divide the light emitted by the sample into different directions. The elemental images from different view angles contain original 3D information and is recorded by a high-resolution image sensor. On the basis of the multi-view stereo information contained in the image, the elemental images can be refocused into multi-focus images. The 3D information can be directly extracted from the multi-focus images through self-developed algorithms. Experiment results show that the system can complete the measurement in 2 seconds and reach a high measurement accuracy at a sub-micrometer level. This verifies the feasibility of the proposed measurement system which is efficient and accurate for 3D inspection of wire bonding.
AB - The quality of wire bonding is an important factor in the manufacturing of various precision electronic components in semiconductor industry. The wire bonding defects, including high loop and low loop, determined by the bonding height information, inevitably affect the performance of the product. It is vital to measure height information quickly and accurately to reduce the failure rate in the manufacturing process. However, traditional measurement system often needs to move the target samples for a number of times. To address the key measurement problems, a three-dimensional (3D) optical measurement system is developed based on autostereoscopy technologies. A micro-lens array is used to divide the light emitted by the sample into different directions. The elemental images from different view angles contain original 3D information and is recorded by a high-resolution image sensor. On the basis of the multi-view stereo information contained in the image, the elemental images can be refocused into multi-focus images. The 3D information can be directly extracted from the multi-focus images through self-developed algorithms. Experiment results show that the system can complete the measurement in 2 seconds and reach a high measurement accuracy at a sub-micrometer level. This verifies the feasibility of the proposed measurement system which is efficient and accurate for 3D inspection of wire bonding.
KW - autostereoscopy
KW - precision metrology
KW - rapid measurement
KW - semiconductor
KW - three-dimensional measurement
KW - wire bonding
UR - http://www.scopus.com/inward/record.url?scp=85115446675&partnerID=8YFLogxK
U2 - 10.1109/ICOIM52180.2021.9524422
DO - 10.1109/ICOIM52180.2021.9524422
M3 - Conference article published in proceeding or book
AN - SCOPUS:85115446675
T3 - 2021 International Conference of Optical Imaging and Measurement, ICOIM 2021
SP - 145
EP - 148
BT - 2021 International Conference of Optical Imaging and Measurement, ICOIM 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 International Conference of Optical Imaging and Measurement, ICOIM 2021
Y2 - 27 August 2021 through 29 August 2021
ER -