Artificial Intelligence-Aided Thermal Model Considering Cross-Coupling Effects

  • Yi Zhang
  • , Zhongxu Wang
  • , Huai Wang
  • , Frede Blaabjerg

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

This letter proposes an artificial intelligence-aided thermal model for power electronic devices/systems considering thermal cross-coupling effects. Since multiple heat sources can be applied simultaneously in the thermal system, the proposed method is able to characterize model parameters more conveniently compared to existing methods where only single heat source is allowed at a time. By employing simultaneous cooling curves, linear-to-logarithmic data re-sampling, and differentiated power losses, the proposed artificial neural network-based thermal model can be trained with better data richness and diversity while using fewer measurements. Finally, experimental verifications are conducted to validate the model capabilities.

Original languageEnglish
Article number9034112
Pages (from-to)9998-10002
Number of pages5
JournalIEEE Transactions on Power Electronics
Volume35
Issue number10
DOIs
Publication statusPublished - Oct 2020
Externally publishedYes

Keywords

  • Artificial intelligence
  • power electronic devices and systems
  • thermal cross-coupling effects
  • thermal modeling

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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