Arbitrarily oriented crack near interface in piezoelectric bimaterials

Wen ye Tian, Kam Tim Chau

Research output: Journal article publicationJournal articleAcademic researchpeer-review

7 Citations (Scopus)

Abstract

Arbitrarily oriented crack near interface in piezoelectric bimaterials is considered. After deriving the fundamental solution for an edge dislocation near the interface, the present problem can be expressed as a system of singular integral equations by modeling the crack as continuously distributed edge dislocations. In the paper, the dislocations are described by a density function defined on the crack line. By solving the singular integral equations numerically, the dislocation density function is determined. Then, the stress intensity factors (SIFs) and the electric displacement intensity factor (EDIF) at the crack tips are evaluated. Subsequently, the influences of the interface on crack tip SIFs, EDIF, and the mechanical strain energy release rate (MSERR) are investigated. The J-integral analysis in piezoelectric bimaterals is also performed. It is found that the path-independent of J1-integral and the path-dependent of J2-integral found in no-piezoelectric bimaterials are still valid in piezoelectric bimaterials.
Original languageEnglish
Pages (from-to)1943-1958
Number of pages16
JournalInternational Journal of Solids and Structures
Volume40
Issue number8
DOIs
Publication statusPublished - 1 Jan 2003

Keywords

  • Crack
  • Dislocation
  • Interface
  • J-integral
  • Piezoelectric bimaterials

ASJC Scopus subject areas

  • Modelling and Simulation
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics

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