Abstract
This paper develops a process modeling method of epoxy dispensing for microchip encapsulation based on Tanaka's fuzzy regression approach, in which the deviations between the observed values and the estimated values are expressed as the possibilities using fuzzy concept rather than statistical. In the paper, two kinds of fuzzy regression models for Fill and Dam processes of Epoxy dispensing process, expressing the correlation between various process parameters and the two quality characteristics respectively, have been developed. Validation experiments have been performed to demonstrate the effectiveness of the process modeling method.
| Original language | English |
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| Title of host publication | IEEE International Engineering Management Conference |
| Pages | 1121-1125 |
| Number of pages | 5 |
| Publication status | Published - 1 Dec 2004 |
| Event | Proceedings - 2004 IEEE International Engineering Management Conference: Innovation and Entrepreneurship for Sustainable Development, IEMC 2004 - , Singapore Duration: 18 Oct 2004 → 21 Oct 2004 |
Conference
| Conference | Proceedings - 2004 IEEE International Engineering Management Conference: Innovation and Entrepreneurship for Sustainable Development, IEMC 2004 |
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| Country/Territory | Singapore |
| Period | 18/10/04 → 21/10/04 |
Keywords
- Epoxy dispensing process
- Fuzzy linear regression
ASJC Scopus subject areas
- General Engineering
- Management Science and Operations Research