Application of fuzzy linear regression in modeling epoxy dispensing process

H. Bai, Chun Kit Kwong

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

This paper develops a process modeling method of epoxy dispensing for microchip encapsulation based on Tanaka's fuzzy regression approach, in which the deviations between the observed values and the estimated values are expressed as the possibilities using fuzzy concept rather than statistical. In the paper, two kinds of fuzzy regression models for Fill and Dam processes of Epoxy dispensing process, expressing the correlation between various process parameters and the two quality characteristics respectively, have been developed. Validation experiments have been performed to demonstrate the effectiveness of the process modeling method.
Original languageEnglish
Title of host publicationIEEE International Engineering Management Conference
Pages1121-1125
Number of pages5
Publication statusPublished - 1 Dec 2004
EventProceedings - 2004 IEEE International Engineering Management Conference: Innovation and Entrepreneurship for Sustainable Development, IEMC 2004 - , Singapore
Duration: 18 Oct 200421 Oct 2004

Conference

ConferenceProceedings - 2004 IEEE International Engineering Management Conference: Innovation and Entrepreneurship for Sustainable Development, IEMC 2004
Country/TerritorySingapore
Period18/10/0421/10/04

Keywords

  • Epoxy dispensing process
  • Fuzzy linear regression

ASJC Scopus subject areas

  • Engineering(all)
  • Management Science and Operations Research

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