Analytical thermal modeling for conventional and in-situ laser assisted turning

Cutting heat dynamics play a pivotal role in machining quality and efficiency, making the accurate prediction of cutting temperatures and their distributions essential. This study presents an advanced analytical thermal model designed to predict temperature distribution across the chip, tool, and workpiece during single-point diamond turning and in-situ laser-assisted turning. A novel approach combining an analytical force model with an optimization algorithm is introduced to precisely calculate heat source intensity. The model incorporates the heat intensity distribution along the chip-tool interface, considering the effects of the sticking and sliding zones. Additionally, a new method for calculating the temperature distribution on the tool, caused by a crescent-shaped stationary heat source, is proposed. To enhance accuracy, the model accounts for temperature-dependent thermal conductivity and diffusivity of the workpiece material through iterative refinement. A high-order polynomial fitting is employed to streamline the determination of heat partition ratios, ensuring consistency in temperature predictions for both moving and stationary heat sources. The proposed models are validated through comparisons with infrared imaging and finite element method simulations, providing a robust theoretical framework for predicting temperature behavior in ultra-precision and precision turning processes.