Abstract
Thermal stress due to mismatched thermal expansion is a problem that has challenged the electronics packaging industry for decades. Analytical solutions are available in the literature for a tri-material in which the sandwiched layer is an adhesive, but the solutions may not be suitable for a sandwiched layer consisting of discrete elements such as solder joints which experience significant bending. In this paper, closed-form analytical solutions have been developed for both continuous and discrete sandwiched layers by modelling the interconnects as a slab of spring elements capable of transferring axial, shear, and bending load. The analytical solutions have been successfully validated with finite element analysis.
| Original language | English |
|---|---|
| Pages (from-to) | 602-611 |
| Number of pages | 10 |
| Journal | IEEE Transactions on Advanced Packaging |
| Volume | 32 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2009 |
| Externally published | Yes |
Keywords
- Analytical solutions
- Electronics packaging
- Solder joints
- Thermal stress
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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