Analytical solutions for PCB assembly subjected to mismatched thermal expansion

E. H. Wong; K. M. Lim; Y. W. Mai

doi:10.1109/TADVP.2009.2025222

Analytical solutions for PCB assembly subjected to mismatched thermal expansion

E. H. Wong, K. M. Lim, Y. W. Mai

Research output: Journal article publication › Journal article › Academic research › peer-review

14 Citations (Scopus)

Abstract

Thermal stress due to mismatched thermal expansion is a problem that has challenged the electronics packaging industry for decades. Analytical solutions are available in the literature for a tri-material in which the sandwiched layer is an adhesive, but the solutions may not be suitable for a sandwiched layer consisting of discrete elements such as solder joints which experience significant bending. In this paper, closed-form analytical solutions have been developed for both continuous and discrete sandwiched layers by modelling the interconnects as a slab of spring elements capable of transferring axial, shear, and bending load. The analytical solutions have been successfully validated with finite element analysis.

Original language	English
Pages (from-to)	602-611
Number of pages	10
Journal	IEEE Transactions on Advanced Packaging
Volume	32
Issue number	3
DOIs	https://doi.org/10.1109/TADVP.2009.2025222
Publication status	Published - 2009
Externally published	Yes

Keywords

Analytical solutions
Electronics packaging
Solder joints
Thermal stress

ASJC Scopus subject areas

Electrical and Electronic Engineering

More information

10.1109/TADVP.2009.2025222

Cite this

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Analytical solutions for PCB assembly subjected to mismatched thermal expansion

Abstract

Keywords

ASJC Scopus subject areas

More information

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