Abstract
A fully rigid-elastic-coupled dynamic model was developed for a vibration isolation system consisting of a rigid vibrating machinery, multiple resilient mounts and a floating elastic panel. This model was applied to investigate the vibration power transmission behavior of an X-Y motion stage-based system used in semiconductor wire-bonding equipment. The natural frequencies and modal characteristics of the system and its subsystems were numerically evaluated. The total power flow from the X-Y motion stage (the vibrating machinery) to the equipment table (the floating elastic panel) through multiple resilient mounts and the contribution of each force component at mounting junctions to the total power flow were analysed in the concerned frequency range for different types of excitations. The total power flow predicted by the developed model was also compared with that calculated using a conventional elastic support model. It was shown that the developed model provides a more accurate prediction of the total power flow in the frequency range of interest.
Original language | English |
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Pages (from-to) | 389-404 |
Number of pages | 16 |
Journal | Mechanical Systems and Signal Processing |
Volume | 21 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1 Jan 2007 |
Keywords
- Floating elastic panel
- Power flow
- Semiconductor wire-bonding equipment
- Vibration isolation
- Vibration transmission
- X-Y motion stage
ASJC Scopus subject areas
- Signal Processing
- Mechanical Engineering