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Analysis of Mode II debonding behavior of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading
Wan Yang Gao
, Jianguo Dai
,
Jinguang Teng
The Hong Kong Polytechnic University
Department of Civil and Environmental Engineering
Research output
:
Journal article publication
›
Journal article
›
Academic research
›
peer-review
100
Citations (Scopus)
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Dive into the research topics of 'Analysis of Mode II debonding behavior of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading'. Together they form a unique fingerprint.
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Keyphrases
Fiber Reinforced Polymer
100%
Debonding Behavior
100%
Thermal Loading
100%
Mechanical Loading
100%
Bond-slip Model
100%
Bonded Joints
100%
Debonding Load
100%
Effective Bond Length
66%
Temperature Rise
33%
Rate of Increase
33%
Bond Length
33%
Temperature Variation
33%
Interfacial Shear Stress
33%
Debonding Process
33%
Interfacial Fracture Energy
33%
Load-displacement Response
33%
Interfacial Slip
33%
Engineering
Fiber-Reinforced Polymer
100%
Mechanical Loading
100%
Joints (Structural Components)
100%
Debonding
100%
Slip Model
60%
Closed Form Solution
40%
Temperature Increase
20%
Displacement Response
20%
Explicit Expression
20%
Interfacial Fracture Energy
20%
Interfacial Shear Stress
20%