Analysis of Mode II debonding behavior of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading

Wan Yang Gao, Jianguo Dai, Jinguang Teng

Research output: Journal article publicationJournal articleAcademic researchpeer-review

47 Citations (Scopus)

Abstract

This paper presents a set of closed-form solutions for Mode II debonding process of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading. Six different bond-slip models are considered in deriving the closed-form solutions. For each bond-slip model, explicit expressions for the debonding load, effective bond length, interfacial shear stress, interfacial slip as well as the load-displacement response are presented. Provided the bond length is sufficiently long, the debonding load depends only on the interfacial fracture energy and the temperature variation. A temperature increase leads to an increase in both the debonding load and the effective bond length, and the rate of increase of the latter depends on the bond-slip model of the interface.
Original languageEnglish
Pages (from-to)241-264
Number of pages24
JournalEngineering Fracture Mechanics
Volume136
DOIs
Publication statusPublished - 1 Mar 2015

Keywords

  • Bond-slip model
  • Concrete
  • Debonding
  • Effective bond length
  • Fiber reinforced polymer (FRP)
  • Interface
  • Steel
  • Substrate
  • Temperature variation

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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