Abstract
An experimental investigation has been carried out to determine the optimum spacing ratio among the heated elements in the cooling of electronic package. Three-by-three heated resistors with different spacing ratio are mounted on the substrate that in turn rests in a tunnel. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option, and a better thermal performance could be obtained when the center-to-center distances between the resistors follow a geometric series. At Re = 800, when the spacing ratio among the heated resistors is 1.8, the highest temperature can decrease 8.24% and the temperature difference among resistors can reduce about 27.62% compared to that of the equi-spaced arrangement.
| Original language | English |
|---|---|
| Pages (from-to) | 3-9 |
| Number of pages | 7 |
| Journal | Heat and Mass Transfer |
| Volume | 39 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 1 Nov 2002 |
ASJC Scopus subject areas
- Condensed Matter Physics
- Fluid Flow and Transfer Processes
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