An optimum spacing problem for three-by-three heated elements mounted on a substrate

S. Chen; Yang Liu

doi:10.1007/s00231-001-0286-3

An optimum spacing problem for three-by-three heated elements mounted on a substrate

S. Chen, Yang Liu

Research output: Journal article publication › Journal article › Academic research › peer-review

32 Citations (Scopus)

Abstract

An experimental investigation has been carried out to determine the optimum spacing ratio among the heated elements in the cooling of electronic package. Three-by-three heated resistors with different spacing ratio are mounted on the substrate that in turn rests in a tunnel. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option, and a better thermal performance could be obtained when the center-to-center distances between the resistors follow a geometric series. At Re = 800, when the spacing ratio among the heated resistors is 1.8, the highest temperature can decrease 8.24% and the temperature difference among resistors can reduce about 27.62% compared to that of the equi-spaced arrangement.

Original language	English
Pages (from-to)	3-9
Number of pages	7
Journal	Heat and Mass Transfer/Waerme- und Stoffuebertragung
Volume	39
Issue number	1
DOIs	https://doi.org/10.1007/s00231-001-0286-3
Publication status	Published - 1 Nov 2002

ASJC Scopus subject areas

Condensed Matter Physics
Fluid Flow and Transfer Processes

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10.1007/s00231-001-0286-3

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An optimum spacing problem for three-by-three heated elements mounted on a substrate

Abstract

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