An optimum spacing problem for three-by-three heated elements mounted on a substrate

S. Chen, Yang Liu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

21 Citations (Scopus)

Abstract

An experimental investigation has been carried out to determine the optimum spacing ratio among the heated elements in the cooling of electronic package. Three-by-three heated resistors with different spacing ratio are mounted on the substrate that in turn rests in a tunnel. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option, and a better thermal performance could be obtained when the center-to-center distances between the resistors follow a geometric series. At Re = 800, when the spacing ratio among the heated resistors is 1.8, the highest temperature can decrease 8.24% and the temperature difference among resistors can reduce about 27.62% compared to that of the equi-spaced arrangement.
Original languageEnglish
Pages (from-to)3-9
Number of pages7
JournalHeat and Mass Transfer/Waerme- und Stoffuebertragung
Volume39
Issue number1
DOIs
Publication statusPublished - 1 Nov 2002

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Fluid Flow and Transfer Processes

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