An experimental investigation has been carried out to determine the optimum spacing ratio among the heated elements in the cooling of electronic package. Three-by-three heated resistors with different spacing ratio are mounted on the substrate that in turn rests in a tunnel. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option, and a better thermal performance could be obtained when the center-to-center distances between the resistors follow a geometric series. At Re = 800, when the spacing ratio among the heated resistors is 1.8, the highest temperature can decrease 8.24% and the temperature difference among resistors can reduce about 27.62% compared to that of the equi-spaced arrangement.
|Number of pages||7|
|Journal||Heat and Mass Transfer/Waerme- und Stoffuebertragung|
|Publication status||Published - 1 Nov 2002|
ASJC Scopus subject areas
- Condensed Matter Physics
- Fluid Flow and Transfer Processes