An optimum spacing problem for four chips on a horizontal substrate - Mixed convection

Keyphrases

• Mixed Convection 100%
• Optimum Spacing 100%
• Heat Flux 50%
• Maximum Temperature Difference 50%
• Conductive Substrate 50%
• Interfacial Temperature 50%
• Maximum Temperature 50%
• Time Stepping Finite Element Method (TSFEM) 50%
• Equus 50%
• Center-to-center Distance 50%
• Pseudotime 50%
• Thermal Performance 50%
• Operator Splitting 50%
• Geometric Series 50%

Engineering

• Mixed Convection 100%
• Maximum Temperature 100%
• Conductive 50%
• Thermal Performance 50%
• Interfacial Temperature 50%
• Finite Element Analysis 50%
• Heat Flux 50%